HyboFOAM® is a rigid, closed - cell polymethacrylimide (PMI) foam. It is completely halogen - free, and the foam has a uniform cell size.
HyboFOAM® can withstand curing processes at 200℃/0.3MPa and 180℃/0.7MPa. The specific process depends on its density and model (the lower the density, the smaller the maximum applicable process pressure).
HyboFOAM® has excellent compatibility with adhesives such as epoxy resin, bismaleimide resin, polyurethane resin, phenolic resin, unsaturated polyester resin, and vinyl ester resin. It is suitable for common composite curing methods such as autoclave, vacuum bag, RTM, VARTM, VARI, and HP - RTM, meeting various high - performance application scenarios. Due to its excellent surface resin absorption rate, engineers can achieve a perfect balance between peel strength and lightweight requirements.
To meet the processing requirements of workpieces with different sizes and shapes, HyboFOAM® can be easily hot - pressed, bonded with various adhesives, or freely processed by common CNC machine tools.
HyboFOAM® is suitable as the core material for the vast majority of sandwich - structured composite materials. It is applied in aerospace, shipbuilding, wind power, automotive, rail transit, medical equipment, sports equipment, and electronic devices, etc. Its characteristics of lightweight, high strength, high temperature resistance, and easy processing provide an excellent solution for the lightweighting of composite materials.
